The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

電子包裝雜志發表論文，使用實驗和理論(分析和計算機輔助)的方法、方法和技術來解決和解決在電子和光子學組件、設備和系統的分析、設計、制造、測試和操作中遇到的各種機械、材料和可靠性問題。